YHY | YOUNG HE ELECTRONIC |
TECHNOLOGY CO., LIMITED |
Blind - burried Via holes PCBS
8 layer PCB
Material: FR4 TG170;
Finished Thickness :1.60 mm;
Copper thickness : 1OZ finished ;
Surface finishing: Immersion Gold Au 2u".min;
Min Via hole size :0.15mm;
Min Trace width/Spacing : 0.1 /0.1 mm
Blind via from Top to L2 layers , L7 to Bot layers
6 layer PCB
Material: FR4 TG150;
Finished Thickness :1.60 mm;
Copper thickness : 1OZ finished ;
Surface finishing: Immersion Gold , Au 2 u".min;
Min Via hole size :0.2mm;
Min Trace width/ spacing : 0.112 mm / 0.112 mm
Burried Via hole from L2 to L5
8 layer PCB
Material: FR4 TG170;
Finished Thickness :1.60 mm;
Copper thickness : 1OZ finished ;
Surface finishing: OSP ;
Min Via hole size :0.2mm;
Min Trace width/ spacing : 0.11 mm / 0.11 mm
Blind via from Top layer to l3 layer.
6 layer PCB
Material: FR4 TG170;
Finished Thickness :2.0 mm;
Copper thickness : 1OZ finished ;
Surface finishing: Immersion Gold , Au 3 u".min
Min Via hole size :0.15mm;
Min Trace width/ spacing : 0.076 mm / 0.076 mm
Blind via hole from Top to l2 layer , l5 to bot layer
Email : sales@younghe-tech.com